激光錫球焊接工藝:
應用領域:
激光錫球焊錫機 | LAB730 |
機器外形尺寸Dimension | 980 * 1100 * 1780mm |
運動行程(X*Y *Z/C)Travel Range | 500 *650 *80/80mm |
產品最大尺寸 Product Max .Size | 200 *300/200 *300mm |
運動控制方式 Motion Control Mode | 微型工控機(IPC) |
驅動方式Drive Mode | 伺服馬達/伺服絲桿 Servo r Motor/Ball Screw |
機器軸數(shù)Number of Axis | 6 Axes |
激光功率范圍Laser Power Range | 0-300W |
最大移動速度Travel Maximum | 1000mm/s |
電源最大功耗Max Power Consumption | 185-265V/1500W |
電源平均功耗Average Power Consumption | 450W |
重復定位精度Repeat Position Accuracy | ±0 .01mm |
錫球范圍Diameter of Solder Ball | 0.2-1.8mm |
總重量Weight | 700Kg |
激光光源種類Laser Type | 光纖 Fiber Laser |
最小焊接間距Minimum Soldering Distance | 0.2mm |
氮氣壓力Nitrogen Pressure | 3-12Bar |
氮氣流速Nitrogen Flow Rate | 0.75L/min |